Heatsinks, Enclosures, Connectors, Fischer Elektronik, Dau Components

Thermally conductive adhesiveWLK 5 : WLK 5 WLK 10

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specific thermal resistance R_th

1.2 m·K/W

volume resistance

10¹⁶ Ω/cm

hardening time

20°C approx. 16-24h / 25°C approx. 8 h / 120°C approx. 20 min

glue layer

Epoxid

mixture proportion

10:1

composition

5 g resin/0.5 g hardener

thermal conductivity

0.836 W/m·K

temperature range

-56°C... +149°C

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WLK 5

WLK 5

WLK 5

WLK 5

WLK 5

WLK 5

WLK 5

WLK 5

WLK 5

WLK 5

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