Heatsinks, Enclosures, Connectors, Fischer Elektronik, Dau Components

Pin heatsinksICK S R 32,5 x 20 : ICK S R 32.5 x 20

Add to request.

design

round

way of fixation

therm. conductive foil
therm. cond. adhesive

socket

universal

suitable for processor type

universal

diameter Ø

32.5 mm

height

20 mm

plate thickness

3 mm

weight

13.8 g

thermal resistance R_th

10 - 1.5 K/W

dissipation loss P_v

6 W

surface

Al-natural

DAU Telephone (+44) 01243 553031

For further information, technical & product support contact - Technical
For pricing, lead-times and sample requests contact - Sales

ICK S R 32.5 x 20

ICK S R 32.5 x 20

ICK S R 32.5 x 20

ICK S R 32.5 x 20

ICK S R 32.5 x 20

ICK S R 32.5 x 20

ICK S R 32.5 x 20

ICK S R 32.5 x 20

ICK S R 32.5 x 20

ICK S R 32.5 x 20

SMD Heatsinks on Tape and Reel

TOLA Case Series

New Skived Fin Heatsinks

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