Pin heatsinks  : ICK S R 50 x 20
design
round
way of fixation
  • therm. conductive foil
  • therm. cond. adhesive
socket
universal
suitable for processor type
universal
diameter Ø
50 mm
height
20 mm
plate thickness
3 mm
weight
34.39 g
thermal resistance Rth
7 - 1.2 K/W
dissipation loss Pv
8.57 W
surface
Al-natural
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