Heatsinks, Enclosures, Connectors, Fischer Elektronik, Dau Components

Pin heatsinks : ICK S R 54 x 30

Add to request.

design

round

way of fixation

therm. conductive foil
therm. cond. adhesive

socket

universal

suitable for processor type

universal

diameter Ø

54 mm

height

30 mm

plate thickness

3.5 mm

weight

54.11 g

thermal resistance R_th

5.05 - 0.85 K/W

dissipation loss P_v

11.88 W

surface

Al-natural

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For pricing, lead-times and sample requests contact - Sales

ICK S R 54 x 30

ICK S R 54 x 30

ICK S R 54 x 30

ICK S R 54 x 30

ICK S R 54 x 30

ICK S R 54 x 30

ICK S R 54 x 30

ICK S R 54 x 30

ICK S R 54 x 30

ICK S R 54 x 30

SMD Heatsinks on Tape and Reel

TOLA Case Series

New Skived Fin Heatsinks

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