Pin heatsinks  : ICK S R 70 x 50
design
round
way of fixation
  • therm. conductive foil
  • therm. cond. adhesive
socket
universal
suitable for processor type
universal
diameter Ø
70 mm
height
50 mm
plate thickness
5 mm
weight
135.56 g
thermal resistance Rth
3.5 - 0.75 K/W
dissipation loss Pv
17.14 W
surface
Al-natural
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