Copper heatsinks for D PAK and others – FK 244 08 D PAK

Product ID

FK 244 08 D PAK

Product Category

Board Level Heatsinks

Description

Parameters

Features

for transistor SOT 223

D3 PAK (TO 268)

SO-14

D2 PAK (TO 263)

Power SO 10

D PAK (TO 252)

SO-16

SO-8

width 23mm
height 10mm
length 8mm
thermal resistance 31.5K/W
surface solderable surface
material copper (Cu)
material thickness 0.6mm

Datasheet

Download datasheet

Description

Product ID

FK 244 08 D PAK

Product Category

Board Level Heatsinks

Description

Parameters

Features

for transistor SOT 223

D3 PAK (TO 268)

SO-14

D2 PAK (TO 263)

Power SO 10

D PAK (TO 252)

SO-16

SO-8

width 23mm
height 10mm
length 8mm
thermal resistance 31.5K/W
surface solderable surface
material copper (Cu)
material thickness 0.6mm

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

8mm

Width (mm)

23mm

Height (mm)

10mm

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