Copper heatsinks for D PAK and others – FK 244 08 D2 PAK

Product ID

FK 244 08 D2 PAK

Product Category

Board Level Heatsinks

Description

Parameters

Features

for transistor SOT 223

D3 PAK (TO 268)

SO-14

D2 PAK (TO 263)

Power SO 10

D PAK (TO 252)

SO-16

SO-8

width 26mm
height 10mm
length 8mm
thermal resistance 29.3K/W
surface solderable surface
material copper (Cu)
material thickness 0.6mm

Datasheet

Download datasheet

Description

Product ID

FK 244 08 D2 PAK

Product Category

Board Level Heatsinks

Description

Parameters

Features

for transistor SOT 223

D3 PAK (TO 268)

SO-14

D2 PAK (TO 263)

Power SO 10

D PAK (TO 252)

SO-16

SO-8

width 26mm
height 10mm
length 8mm
thermal resistance 29.3K/W
surface solderable surface
material copper (Cu)
material thickness 0.6mm

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

8mm

Width (mm)

26mm

Height (mm)

10mm

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