Finger shaped heatsinks – FK 208 SA L

Product ID

FK 208 SA L

Product Category

Board Level Heatsinks

Description

for semiconductor-design TO 3. SOT 9. TO 66. SOT 32. TO 220

Parameters

Features

material aluminium
for transistor TO 3 – SOT 9 + TO 66 – SOT 32 – TO 220
width 33mm
height 12.7mm
length 41.3mm
thermal resistance 14K/W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

FK 208 SA L

Product Category

Board Level Heatsinks

Description

for semiconductor-design TO 3. SOT 9. TO 66. SOT 32. TO 220

Parameters

Features

material aluminium
for transistor TO 3 – SOT 9 + TO 66 – SOT 32 – TO 220
width 33mm
height 12.7mm
length 41.3mm
thermal resistance 14K/W
surface black anodised

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

41.3mm

Width (mm)

33mm

Height (mm)

12.7mm

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