Description
Product ID
ICK BGA 15 x 15 x 6
Product Category
For Processors
Description
15 x 15 x 6Â mm, for IC design BGA and others
Parameters
Features
way of fixation | therm. conductive foil
therm. cond. adhesive |
socket | universal |
suitable for processor type | universal |
width | 15mm |
height | 6mm |
plate thickness | 1.8mm |
length | 15mm |
thermal resistance | 29.5 – 8K/W |
dissipation loss | 2W |
surface | black anodised |