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Heatsinks for BGAs – ICK BGA 19 x 19 x 10

Description

ICK BGA 19 x 19 x 10

For Processors

19 x 19 x 10 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	19mm
height	10mm
plate thickness	1.8mm
length	19mm
thermal resistance	26 – 10K/W
dissipation loss	2.3W
surface	black anodised