Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Heatsinks for BGAs – ICK BGA 27 x 27 x 14

Description

ICK BGA 27 x 27 x 14

For Processors

27 x 27 x 14 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	27mm
height	14mm
plate thickness	2.5mm
length	27mm
thermal resistance	13.5 – 4K/W
dissipation loss	9.5W
surface	black anodised