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Heatsinks for BGAs – ICK BGA 31 x 31 x 10

Description

ICK BGA 31 x 31 x 10

For Processors

31 x 31 x 10 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	31mm
height	10mm
plate thickness	1.8mm
length	31mm
thermal resistance	17 – 5K/W
dissipation loss	3.7W
surface	black anodised