Heatsinks for BGAs – ICK BGA 35 x 35

Product ID

ICK BGA 35 x 35

Product Category

For Processors

Description

35 x 35 x 6 mm, for IC design BGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 35mm
height 6mm
plate thickness 1.8mm
length 35mm
thermal resistance 16.5 – 5.8K/W
dissipation loss 3.7W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

ICK BGA 35 x 35

Product Category

For Processors

Description

35 x 35 x 6 mm, for IC design BGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 35mm
height 6mm
plate thickness 1.8mm
length 35mm
thermal resistance 16.5 – 5.8K/W
dissipation loss 3.7W
surface black anodised

Datasheet

Download datasheet

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