Heatsinks for PGA – ICK PGA 14 x 14 x 12

Product ID

ICK PGA 14 x 14 x 12

Product Category

For Processors

Description

36 x 36 x 12.3 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 36mm
height 12.3mm
plate thickness 3.5mm
length 36mm
thermal resistance 9.8 – 2.1K/W
dissipation loss 5.3W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

ICK PGA 14 x 14 x 12

Product Category

For Processors

Description

36 x 36 x 12.3 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 36mm
height 12.3mm
plate thickness 3.5mm
length 36mm
thermal resistance 9.8 – 2.1K/W
dissipation loss 5.3W
surface black anodised

Datasheet

Download datasheet

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