Heatsinks for PGA – ICK PGA 15 x 15

Product ID

ICK PGA 15 x 15

Product Category

For Processors

Description

38,1 x 37,92 x 16,5 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 38.1mm
height 16.51mm
plate thickness 3.5mm
length 37.92mm
thermal resistance 9.4 – 2.1K/W
dissipation loss 5.9W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

ICK PGA 15 x 15

Product Category

For Processors

Description

38,1 x 37,92 x 16,5 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 38.1mm
height 16.51mm
plate thickness 3.5mm
length 37.92mm
thermal resistance 9.4 – 2.1K/W
dissipation loss 5.9W
surface black anodised

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

37.92mm

Width (mm)

38.1mm

Height (mm)

16.51mm

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