Description
Product ID
ICK PGA 20 x 20 x 8
Product Category
For Processors
Description
50,8 x 50,8 x 8 mm, for IC design PGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 50.8mm |
| height | 8mm |
| plate thickness | 3mm |
| length | 50.8mm |
| thermal resistance | 12 – 3K/W |
| dissipation loss | 6.3W |
| surface | black anodised |
