Description
Product ID
ICK S R 32.5 x 30
Product Category
For Processors
Description
Ø 32.5 x 30 mm, pin heatsinks round
Parameters
Features
| design | round |
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| diameter | 32.5mm |
| height | 30mm |
| plate thickness | 3.5mm |
| weight | 20.6g |
| thermal resistance | 8.8 – 1.6K/W |
| dissipation loss | 6.82W |
| surface | Al-natural |
