ICK S R 32.5 x 30
For Processors
Ø 32.5 x 30 mm, pin heatsinks round
| design | round |
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| diameter | 32.5mm |
| height | 30mm |
| plate thickness | 3.5mm |
| weight | 20.6g |
| thermal resistance | 8.8 – 1.6K/W |
| dissipation loss | 6.82W |
| surface | Al-natural |
ICK S R 32.5 x 30
For Processors
Ø 32.5 x 30 mm, pin heatsinks round
| design | round |
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| diameter | 32.5mm |
| height | 30mm |
| plate thickness | 3.5mm |
| weight | 20.6g |
| thermal resistance | 8.8 – 1.6K/W |
| dissipation loss | 6.82W |
| surface | Al-natural |
| Surface | |
|---|---|
| Height (mm) | 30mm |
DAU Components Limited
68 – 74 Barnham Road, Barnham West Sussex, PO22 0ES, UK
Tel: +44 (0) 1243 553031
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