US 58 4
Mounting Material for Single Semiconductors
for semiconductor-design TO 5
*mounting pads: the US-pads convent the TO 5 pin circle to a pitch of .1″
| for transistor | TO 5 |
| material | polyamide 6, GF reinforced |
| temperature range | -40°C… +205°C |
| class of inflammability | UL 94 V-0 (at thickness ≥3mm), UL 94 V-1 |
US 58 4
Mounting Material for Single Semiconductors
for semiconductor-design TO 5
*mounting pads: the US-pads convent the TO 5 pin circle to a pitch of .1″
| for transistor | TO 5 |
| material | polyamide 6, GF reinforced |
| temperature range | -40°C… +205°C |
| class of inflammability | UL 94 V-0 (at thickness ≥3mm), UL 94 V-1 |
DAU Components Limited
68 – 74 Barnham Road, Barnham West Sussex, PO22 0ES, UK
Tel: +44 (0) 1243 553031
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