Description
Product ID
KAP 218 O
Product Category
Thermal Interface Material
Description
for semiconductor-design TO 218, 23 x 18 mm
Parameters
- thermal resistance:: 0.15 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (KAP 3)]
- temperature range:: -40°C… +150°C
- thermal conductivity:: 0.45 W/m·K (substrate)
- insulation resistance:: 1014 Ω
- material thickness:: 0.077mm (substrate 0.05mm)
- elongation:: 30%
- dielectric strength:: 7.8 kV
- class of inflammability:: UL 94 V-0
Features
| for transistor | TO 218 |
| material | polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely coated on both sides |
| phase change temperature | 52°C |
| thermal resistance | 0.15 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (KAP 3)] |
| temperature range | -40°C… +150°C |
| thermal conductivity | 0.45 W/m·K (substrate) |
| insulation resistance | 1014 Ω |
| material thickness | 0.077mm (substrate 0.05mm) |
| elongation | 30% |
| dielectric strength | 7.8 kV |
| class of inflammability | UL 94 V-0 |
| type of delivery | cut |
