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Heatsinks for BGAs – ICK BGA 14 x 14 x 10

Description

ICK BGA 14 x 14 x 10

For Processors

14 x 14 x 10 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	14mm
height	10mm
plate thickness	1.8mm
length	14mm
thermal resistance	27.4 – 8K/W
dissipation loss	2.3W
surface	black anodised