Description
Product ID
ICK BGA 14 x 14 x 14
Product Category
For Processors
Description
14 x 14 x 14 mm, for IC design BGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 14mm |
| height | 14mm |
| plate thickness | 2.5mm |
| length | 14mm |
| thermal resistance | 25.9 – 6.5K/W |
| dissipation loss | 2.3W |
| surface | black anodised |
