Description
Product ID
ICK BGA 21 x 21 x 10
Product Category
For Processors
Description
21 x 21 x 10 mm, for IC design BGA and others
Parameters
Features
way of fixation | therm. conductive foil
therm. cond. adhesive |
socket | universal |
suitable for processor type | universal |
width | 21mm |
height | 10mm |
plate thickness | 1.8mm |
length | 21mm |
thermal resistance | 23 – 6K/W |
dissipation loss | 2.6W |
surface | black anodised |