Heatsinks for BGAs – ICK BGA 37 x 37 x 6

ICK BGA 37 x 37 x 6

For Processors

37 x 37 x 6 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	37mm
height	6mm
plate thickness	1.8mm
length	37mm
thermal resistance	15.7 – 6K/W
dissipation loss	9.5W
surface	black anodised

Description

ICK BGA 37 x 37 x 6

For Processors

37 x 37 x 6 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	37mm
height	6mm
plate thickness	1.8mm
length	37mm
thermal resistance	15.7 – 6K/W
dissipation loss	9.5W
surface	black anodised