Heatsinks for PGA – ICK PGA 14 x 14

Product ID

ICK PGA 14 x 14

Product Category

For Processors

Description

34.5 x 31.34 x 16.51 , for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 34.5mm
height 16.51mm
plate thickness 5mm
length 31.34mm
thermal resistance 10 – 2.3K/W
dissipation loss 4.9W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

ICK PGA 14 x 14

Product Category

For Processors

Description

34.5 x 31.34 x 16.51 , for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 34.5mm
height 16.51mm
plate thickness 5mm
length 31.34mm
thermal resistance 10 – 2.3K/W
dissipation loss 4.9W
surface black anodised

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

31.34mm

Width (mm)

34.5mm

Height (mm)

16.51mm

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