Description
Product ID
ICK PGA 8 x 8 x 12
Product Category
For Processors
Description
23 x 23 x 12.3 mm, for IC design PGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 23mm |
| height | 12.3mm |
| plate thickness | 2.5mm |
| length | 23mm |
| thermal resistance | 14.8 – 4K/W |
| dissipation loss | 8.1W |
| surface | black anodised |
