Heatsinks, cooling fans, thermal interface materials and heat dissipating enclosures for electronic and industrial systems. Supplied from the UK by an authorised distributor of Fischer Elektronik and Cooltron.
For temperature critical applications, from initial specification through to volume supply. Available off the shelf or customised to specification, with solutions designed to support reliable performance in demanding environments.
Browse our full thermal management range. Each category includes detailed specifications and support for selecting the right solution.
Extruded aluminium and board level heatsinks designed for efficient passive heat dissipation across electronic and industrial systems.
Industrial axial fans from Cooltron in AC, DC and EC variants, designed for airflow control and active cooling in equipment.
Industrial axial fans from Cooltron in AC, DC and EC variants, designed for airflow control and active cooling in equipment.
Industrial axial fans from Cooltron in AC, DC and EC variants, designed for airflow control and active cooling in equipment.
We design and supply custom thermal management solutions for manufacturers with specific cooling requirements. Our technical team works with you to develop heatsinks, enclosures or fan assemblies tailored to your operating conditions and dimensional constraints.
Share your thermal requirements, constraints and operating conditions with our technical team.
We develop a proposed solution with drawings, thermal performance data and costs.
Samples are manufactured for validation against your performance requirements.
Approved designs move to prodcution with quality control and scheduled delivery.
We supply industrial cooling systems to organisations operating in temperature critical and performance driven environments. Each industry presents different thermal loads, environmental conditions and reliability requirements.
Selecting the right solution depends on your application requirements and operating conditions.
Calculate total heat dissipation in watss, including peak conditions and safety margins.
Consider ambient temprature, airflow conditions, ingreess protection and vibration.
Passive solutions use heatsinks or enclosures. Active solutions use fans to increase heat dissipation.
Account for available space, mounting positions and integration with other components.
For active cooling, define voltage, control signals and integration requirements.
Thermal management in electronics is the process of controlling and dissipating heat generated by components to keep them within safe operating temperatures. Without an effective heat path, temperatures rise, performance degrades and component life is reduced. Thermal management ensures heat is transferred away from critical components through conduction, convection or radiation.
Thermal management relies on three core mechanisms, each used depending on the application and operating environment.
1
Heat transfers from a component into a heatsink or enclosure through direct contact.
Method:
Direct Transfer
2
Airflow removes heat from surfaces. Cooling fans increase heat dissipation by moving air across components.
Method:
Active Cooling
3
Heat is emitted from surfaces into the surrounding environment, supporting passive cooling systems.
Method:
Passive Cooling
Authorised distribution ensuring genuine products and technical excellence.
Leading manufacturer of heatsinks, enclosures and thermal interface materials, certified to ISO 9001 and ISO 14001.
Manufacturer of industrial cooling fans specialising in AC, DC and EC technologies.
Find answers to common questions about thermal management solutions and components.
Thermal management is the control and dissipation of heat generated by electronic components to maintain safe operating temperatures. It involves heatsinks, cooling fans, thermal interface materials and enclosures working together to transfer heat away from critical components. Without effective thermal management, component temperatures rise, performance drops and service life is reduced.
Thermal management solutions are the components and systems used to control and dissipate heat in electronic and industrial equipment. They include passive solutions such as heatsinks and heat dissipating enclosures, active solutions such as cooling fans and aggregates, and thermal interface materials that reduce contact resistance. We supply a full range of thermal management solutions from Fischer Elektronik and Cooltron.
The three primary types are conduction, convection and radiation. Conductive cooling uses heatsinks and thermal interface materials to draw heat from components. Convective cooling uses fans to move air across heat-generating surfaces. Radiative cooling uses enclosures and surfaces to emit heat into the environment. Most industrial systems combine two or more of these approaches depending on the thermal load and operating conditions.
We supply heatsinks, industrial cooling fans, thermal interface materials and heat dissipating enclosures from authorised manufacturers. Products are available off the shelf for immediate supply or modified to suit your application. Our range covers Fischer Elektronik heatsinks and enclosures, Cooltron AC, DC and EC axial fans, and a comprehensive selection of thermal interface materials.
Yes. All products comply with RoHS and current REACH requirements. Fischer Elektronik holds ISO 9001:2015 and ISO 14001:2015 certification. Compliance documentation, including RoHS declarations and REACH SVHC statements, is available on request. If you require specific documentation for a project or regulatory submission, contact our team and we will provide the relevant certificates.
Passive thermal management uses heatsinks or enclosures without any moving parts. Heat is dissipated through conduction and radiation alone, with no fan required. Active thermal management adds a cooling fan to increase airflow across heat-generating surfaces, enabling higher heat dissipation at the cost of additional components and potential maintenance. The right choice depends on your thermal load, available space and reliability requirements.
Yes. We support manufacturer led modifications including custom heatsinks with machined profiles and surface finishes, fan assemblies with specific voltages and connectors, and heat dissipating enclosures designed to meet IP or EMC requirements. For more complex applications, thermal modelling and validation is available through specialist partners before production. Contact our team to discuss your requirements.
Submit your requirements through our request for quote form or contact our team directly by phone or email. To help us respond quickly, include the application details, thermal load, key dimensions, operating temperature range and required quantity. We typically respond within one working day with product recommendations and pricing.
