Heat dissipating enclosures for sealed electronic systems
We supply heat dissipating enclosures from Fischer Elektronik, designed to provide effective passive cooling within fully sealed electronic housings. Using integrated external fin structures, these enclosures function as a heatsink, transferring heat from internal components to the external surface where it dissipates naturally into the surrounding environment.
This approach removes the need for fans or ventilation openings, enabling reliable thermal management in applications where dust, moisture or environmental exposure make open cooling systems impractical.
As an authorised UK distributor, we supply standard and EMC-shielded enclosure configurations, with support for custom lengths and machined end panels to match your application requirements.
ENCLOSURES WITH THERMAL MANAGEMENT
M Cases
Fischer Elektronik M Cases are extruded aluminium heat dissipating enclosures with integrated external fin structures, designed for passive cooling in fully sealed environments. Heat generated by internal electronics is conducted through the enclosure body to the external fins, where it dissipates by natural convection. This enables effective thermal management without fans or ventilation openings, while maintaining full environmental protection.
M Cases are rated to IP68 as standard, making them suitable for applications exposed to dust, water and harsh outdoor conditions. EMC-shielded variants are also available for applications requiring electromagnetic protection.
The modular extruded design allows enclosures to be supplied in custom lengths, with end panels machined for connectors, cable glands, display windows and mounting features. Typical applications include outdoor monitoring systems, industrial control equipment, telecommunications infrastructure, marine electronics and transport systems.
SELECTING HEAT DISSIPATING ENCLOSURES
Selecting the right heat dissipating enclosure depends on how heat is generated and how it can be transferred away from internal components.
Heat is conducted through the enclosure body to the external fin structure, where it dissipates into the surrounding environment by natural convection. Performance is influenced by enclosure size, fin geometry, ambient temperature and airflow conditions around the enclosure. Where airflow is limited or environmental sealing is required, heat dissipating enclosures provide a reliable alternative to open heatsinks and fan-based cooling systems.
If you are unsure which enclosure profile is suitable, we can review your power dissipation, internal layout and operating conditions to recommend an appropriate solution.
When to use Heat Dissipating Enclosures
Heat dissipating enclosures are typically specified when:
- A sealed enclosure is required, typically IP65 or above
- The environment includes dust, moisture or corrosive elements
- Fan noise is not acceptable
- Maintenance access is limited over the product lifetime
- EMC shielding is required alongside thermal management
Fischer Elektronik
Fischer Elektronik is a leading heatsink manufacturer specialising in thermal management components, enclosures and interface materials. As an authorised UK distributor, we provide access to the full range of heat dissipating enclosures with consistent availability, technical support and compliance documentation. Products meet ISO 9001 standards and current RoHS and REACH requirements.
Frequently Asked Questions
What is a heat dissipating enclosure?
A heat dissipating enclosure is a sealed electronics housing with an integrated external fin structure that functions as a heatsink. Heat generated by internal components is conducted through the enclosure body and dissipated into the surrounding environment by natural convection, without the need for fans or ventilation openings.
What is the difference between a heat dissipating enclosure and a heatsink?
A heatsink is mounted directly to a component to dissipate heat, whereas a heat dissipating enclosure integrates the heatsink into the enclosure itself. The enclosure body conducts heat from internal electronics to external fins, allowing passive cooling while maintaining a fully sealed housing.
Do heat dissipating enclosures require airflow to work?
Heat dissipating enclosures rely on natural convection and do not require forced airflow. However, airflow around the enclosure improves thermal performance. Installation should allow sufficient space around the fin structure for effective heat dissipation.
What IP rating do Fischer Elektronik M Cases achieve?
Fischer Elektronik M Cases are rated to IP68 as standard. This means they are fully dust-tight and suitable for continuous water immersion, making them suitable for demanding industrial, outdoor and marine environments.
Are EMC-shielded heat dissipating enclosures available?
Yes. M Cases are available in EMC-shielded configurations using conductive sealing, providing electromagnetic protection alongside IP68 sealing and passive thermal management.
How much heat can a heat dissipating enclosure handle?
Thermal performance depends on enclosure size, fin geometry, ambient temperature and airflow conditions. Smaller enclosures may dissipate around five watts, while larger profiles can exceed 50W. We can advise based on your power dissipation and operating conditions.
Can heat dissipating enclosures be supplied in custom sizes?
Yes. Enclosures are manufactured from extruded aluminium profiles and can be supplied in custom lengths. End panels can be machined to include connectors, cable glands, display windows and mounting features.
How do I request a quote?
Provide your internal dimensions, power dissipation, operating temperature and any additional requirements such as EMC shielding or machining. We will recommend a suitable enclosure profile and respond with pricing and lead times within one working day.