We supply board level heatsinks from Fischer Elektronik for PCB-mounted power devices, including clip-on, push-pin, adhesive and attachable types for standard package formats including TO-220, DPAK, D²PAK and SMD components.
Board level heatsinks are used wherever a component generates more heat than its case and surrounding PCB copper can safely dissipate. Common applications include power transistors, MOSFETs, voltage regulators and motor driver ICs.
Board level heatsinks are compact heatsinks that mount directly onto PCB-mounted power devices. Unlike larger chassis-mounted heatsinks, they attach to the component package itself — by clip, push-pin, adhesive or snap fit — and dissipate heat into the airspace above the board. They are specified wherever a component’s power dissipation exceeds what its package and PCB copper can manage alone, providing a targeted cooling solution within the existing PCB assembly.
Clip-on heatsinks use spring clips to attach to standard through-hole packages including TO-220, TO-218 and TO-247. No adhesive or screws are needed, making assembly and rework straightforward.
Attachable heatsinks snap or press onto specific package types such as DPAK and D²PAK using a retention feature in the heatsink body. Common in automotive and industrial power electronics.
Push-pin heatsinks secure through a central pin that passes through the PCB, providing reliable retention without additional hardware. Suitable for automated assembly.
Adhesive heatsinks bond to the component package or PCB surface using a thermally conductive adhesive pad. Suited to SMD components. Note that removal during rework is more difficult than clip-on types.
Standard through-hole power package — wide range of clip-on heatsinks available.
Higher-power through-hole packages — larger clip-on options for greater dissipation.
Surface-mount power package — attachable and adhesive heatsinks available.
Higher-power surface-mount package — dedicated attachable heatsinks from Fischer Elektronik.
Medium-power surface-mount package — small adhesive and attachable options.
Small adhesive heatsinks for custom surface-mount applications.
A board level heatsink is a compact heatsink that mounts directly onto a PCB-mounted power device. It conducts heat from the component package and disperses it into the airspace above the board. Types include clip-on heatsinks for TO-220 packages, push-pin heatsinks for automated assembly, adhesive types for SMD components and attachable heatsinks that snap onto DPAK and D²PAK packages.
Board level heatsinks are available for TO-220, TO-218, TO-247, DPAK, D²PAK and SOT-223 packages, as well as general SMD formats. Please confirm your package type when requesting a quote and we will identify the correct Fischer Elektronik product and advise on compatibility with your component dimensions.
For clip-on and attachable heatsinks, a thermal interface pad or paste between the component case and heatsink contact surface reduces thermal resistance and improves performance. Adhesive-backed heatsinks incorporate a thermal adhesive layer and do not require a separate interface material. We can supply thermal interface materials alongside the heatsinks.
Push-pin heatsinks are well suited to automated PCB assembly processes. Clip-on and attachable types are applied by hand or with appropriate tooling after board assembly. Adhesive-backed heatsinks can be placed by pick-and-place equipment if the adhesive layer is compatible with the process. Contact us to confirm which type is most appropriate for your assembly process.
Fischer Elektronik manufactures board level heatsinks in a wide range of standard sizes. For non-standard dimensions or special thermal requirements, contact our team with your specification and we will advise on the most suitable standard product or feasibility of a custom option, including lead time and minimum order quantity.
