Cooling aggregates combine an extruded aluminium heatsink with one or more integrated axial fans in a single, ready-to-install unit. We supply cooling aggregates from Fischer Elektronik in AC and DC fan variants, suited to power inverters, servo drives, industrial power supplies and other applications where active cooling is required in a compact assembly.
Each aggregate is factory-assembled and performance-matched. Contact our team with your thermal load, supply voltage and mounting dimensions to identify the right product.
A cooling aggregate is a self-contained active cooling assembly that combines an extruded aluminium heatsink with one or more axial fans mounted directly to the fin structure. The fans force air through the heatsink fins, significantly increasing heat dissipation compared to passive cooling alone. The heatsink and fan are factory-assembled and thermally matched, providing a ready-to-install active cooling solution without the need to select and assemble separate components.
AC cooling aggregates operate from mains voltage — 115V or 230V single phase — with no additional power supply required. They are well suited to panel-mounted drives, control cabinets and industrial power electronics where a mains supply is available and fixed-speed operation is appropriate.
DC cooling aggregates operate from 12V or 24V DC and support PWM speed control, allowing fan speed to be matched to thermal load. This reduces noise and extends fan life at lower heat generation levels. Used in embedded systems, telecoms equipment and systems with an existing DC bus.
A cooling aggregate is an integrated assembly combining an extruded aluminium heatsink with one or more axial fans. The fans force air through the heatsink fins, enabling significantly higher heat dissipation than passive cooling alone. Fischer Elektronik cooling aggregates are available in AC fan and DC fan versions and are factory-assembled for direct installation.
A cooling aggregate is the right choice when you need active cooling in a compact, single-unit format and want to avoid the complexity of matching and assembling a heatsink and fan separately. It provides a factory-matched thermal assembly with a defined performance specification, simplifying installation and reducing the risk of incorrect component selection.
For clip-on and attachable heatsinks, a thermal interface pad or paste between the component case and heatsink contact surface reduces thermal resistance and improves performance. Adhesive-backed heatsinks incorporate a thermal adhesive layer and do not require a separate interface material. We can supply thermal interface materials alongside the heatsinks.
Push-pin heatsinks are well suited to automated PCB assembly processes. Clip-on and attachable types are applied by hand or with appropriate tooling after board assembly. Adhesive-backed heatsinks can be placed by pick-and-place equipment if the adhesive layer is compatible with the process. Contact us to confirm which type is most appropriate for your assembly process.
Fischer Elektronik manufactures board level heatsinks in a wide range of standard sizes. For non-standard dimensions or special thermal requirements, contact our team with your specification and we will advise on the most suitable standard product or feasibility of a custom option, including lead time and minimum order quantity.
