Control heat in high power and temperature critical applications with precision engineered heatsinks from a trusted UK supplier.
We supply aluminium and copper heatsinks for electronic devices, from board level components to high power systems. Products are available from stock or supplied to specification, with fast UK delivery and full compliance documentation.
We support engineers and procurement teams in selecting the right heatsink based on thermal load, airflow and design constraints.
Browse our heatsink range by application. Each category includes specification detail to support selection based on thermal performance, size and mounting requirements.
Heatsinks for PCB mounted components including TO220, DPAK and SMD packages. Designed for reliable passive heat dissipation in compact assemblies.
Combined heatsink and fan units for applications requiring forced air cooling and reduced thermal resistance.
Cooling solutions for processors, ICs and power electronics where consistent thermal control is required.
Heatsinks for LED modules and lighting systems, designed to manage heat output and maintain long term performance.
Extruded aluminium heatsinks and cold plates for higher power applications. Available cut to length or modified to specification.
A heatsink removes heat from an electronic component and transfers it into the surrounding air.
Heat is conducted into the heatsink and dissipated across the fin surface area. This reduces operating temperature and protects component performance. Thermal performance is defined by thermal resistance. Lower values indicate more efficient heat transfer.
Selecting the right heatsink depends on thermal performance requirements and physical constraints.
Determine the allowable temperature rise and power dissipation to define the required thermal resistance.
Natural convection requires larger surface area. Forced air reduces thermal resistance and supports more compact designs.
Select a heatsink compatible with your component and assembly method.
A thermal interface material improves heat transfer between contact surfaces and reduces performance loss.
Size is driven by power dissipation, airflow and available space. Higher loads or limited airflow require larger heatsinks.
If requirements are unclear, we can support selection based on your application.
Fischer Elektronik is a leading heatsink manufacturer specialising in thermal management components, enclosures and interface materials. As an authorised UK distributor, we provide access to the full range of heat dissipating enclosures with consistent availability, technical support and compliance documentation. Products meet ISO 9001 standards and current RoHS and REACH requirements.
A heatsink transfers heat away from a component and dissipates it into the surrounding air. Increased surface area improves heat transfer and reduces operating temperature.
Aluminium is the most common material due to its balance of thermal performance, weight and cost. Copper heat sinks are used where higher conductivity is required in compact designs.
Thermal resistance defines how effectively heat is transferred from a component to the air. Lower values indicate better cooling performance.
Yes. A thermal interface material improves contact between surfaces and supports efficient heat transfer.
Heatsink size depends on power dissipation, allowable temperature rise and airflow.
Higher power or limited airflow requires a larger heatsink. Forced air allows for more compact solutions. If you are unsure, DAU Components can support selection.
Yes. Heatsinks can be supplied cut to length or modified with drilling, tapping and surface treatments. DAU Components supports specification and supply based on performance and design requirements.
Yes. Products meet current RoHS and REACH requirements and are supplied with supporting documentation.
Provide your thermal load, component type, required thermal resistance, dimensions and quantity. We will review your requirements and recommend suitable options with pricing and lead times.
