Copper heatsinks for D PAK and others – FK 250 08 LF PAK

Product ID

FK 250 08 LF PAK

Product Category

Board Level Heatsinks

Description

Parameters

Features

for transistor SOT 223

Power SO 8

D3 PAK (TO 268)

Power_SO_20

SO-14

D2 PAK (TO 263)

Power SO 10

D PAK (TO 252)

SOT 669 LF PAK

SO-16

SO IC 8 FL MP

SO-8

Power SO 36

width 15mm
height 8mm
length 8mm
thermal resistance 34.8K/W
surface solderable surface
material copper (Cu)
material thickness 0.6mm

Datasheet

Download datasheet

Description

Product ID

FK 250 08 LF PAK

Product Category

Board Level Heatsinks

Description

Parameters

Features

for transistor SOT 223

Power SO 8

D3 PAK (TO 268)

Power_SO_20

SO-14

D2 PAK (TO 263)

Power SO 10

D PAK (TO 252)

SOT 669 LF PAK

SO-16

SO IC 8 FL MP

SO-8

Power SO 36

width 15mm
height 8mm
length 8mm
thermal resistance 34.8K/W
surface solderable surface
material copper (Cu)
material thickness 0.6mm

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

8mm

Width (mm)

15mm

Height (mm)

8mm

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