Copper heatsinks for D PAK and others – FK 256

Product ID

FK 256

Product Category

Board Level Heatsinks

Description

Parameters

Features

for transistor SOT 223

Power SO 8

D3 PAK (TO 268)

Power_SO_20

SO-14

D2 PAK (TO 263)

Power SO 10

D PAK (TO 252)

SOT 669 LF PAK

SO-16

SO IC 8 FL MP

SO-8

Power SO 36

width 25.4mm
height 11.43mm
length 19.38mm
thermal resistance 11K/W
surface solderable surface
material copper (Cu)
material thickness 0.6mm

Datasheet

Download datasheet

Description

Product ID

FK 256

Product Category

Board Level Heatsinks

Description

Parameters

Features

for transistor SOT 223

Power SO 8

D3 PAK (TO 268)

Power_SO_20

SO-14

D2 PAK (TO 263)

Power SO 10

D PAK (TO 252)

SOT 669 LF PAK

SO-16

SO IC 8 FL MP

SO-8

Power SO 36

width 25.4mm
height 11.43mm
length 19.38mm
thermal resistance 11K/W
surface solderable surface
material copper (Cu)
material thickness 0.6mm

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

19.38mm

Width (mm)

25.4mm

Height (mm)

11.43mm

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