Description
Product ID
FK 278 MI 247 V
Product Category
Board Level Heatsinks
Description
Parameters
Features
| material | copper (Cu) |
| for transistor | TO 220
TO 248 SIP-Multiwatt TO 247 TO 218 |
| width | 23mm |
| height | 9mm |
| length | 35mm |
| thermal resistance | 18.1K/W |
| surface | solderable surface |
| version | with solder lug for vertical installation |
| material thickness | 0.6mm |







