Description
Product ID
ICK BGA 12 x 12 x 18
Product Category
For Processors
Description
12 x 12 x 18 mm, for IC design BGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 12mm |
| height | 18mm |
| plate thickness | 3.6mm |
| length | 12mm |
| thermal resistance | 24.5 – 5.1K/W |
| dissipation loss | 2.3W |
| surface | black anodised |
