ICK BGA 23 x 23
For Processors
23 x 23 x 6 mm, for IC design BGA and others
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 23mm |
| height | 6mm |
| plate thickness | 1.8mm |
| length | 23mm |
| thermal resistance | 22.5 – 6.5K/W |
| dissipation loss | 2.8W |
| surface | black anodised |
ICK BGA 23 x 23
For Processors
23 x 23 x 6 mm, for IC design BGA and others
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 23mm |
| height | 6mm |
| plate thickness | 1.8mm |
| length | 23mm |
| thermal resistance | 22.5 – 6.5K/W |
| dissipation loss | 2.8W |
| surface | black anodised |
| Surface | |
|---|---|
| Length (mm) | 23mm |
| Width (mm) | 23mm |
| Height (mm) | 6mm |
DAU Components Limited
68 – 74 Barnham Road, Barnham West Sussex, PO22 0ES, UK
Tel: +44 (0) 1243 553031
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