Heatsinks for BGAs – ICK BGA 27 x 27 x 22

ICK BGA 27 x 27 x 22

For Processors

27 x 27 x 22 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	27mm
height	22mm
plate thickness	2.5mm
length	27mm
thermal resistance	10.5 – 2K/W
dissipation loss	9.5W
surface	black anodised

Description

ICK BGA 27 x 27 x 22

For Processors

27 x 27 x 22 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	27mm
height	22mm
plate thickness	2.5mm
length	27mm
thermal resistance	10.5 – 2K/W
dissipation loss	9.5W
surface	black anodised