Heatsinks for BGAs – ICK BGA 31 x 31

Product ID

ICK BGA 31 x 31

Product Category

For Processors

Description

31 x 31 x 6 mm, for IC design BGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 31mm
height 6mm
plate thickness 1.8mm
length 31mm
thermal resistance 18.6 – 5.5K/W
dissipation loss 3.4W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

ICK BGA 31 x 31

Product Category

For Processors

Description

31 x 31 x 6 mm, for IC design BGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 31mm
height 6mm
plate thickness 1.8mm
length 31mm
thermal resistance 18.6 – 5.5K/W
dissipation loss 3.4W
surface black anodised

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

31mm

Width (mm)

31mm

Height (mm)

6mm

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