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Heatsinks for BGAs – ICK BGA 33 x 33 x 14

Description

ICK BGA 33 x 33 x 14

For Processors

33 x 33 x 14 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	33mm
height	14mm
plate thickness	1.8mm
length	33mm
thermal resistance	15 – 4.3K/W
dissipation loss	4W
surface	black anodised