Description
Product ID
ICK PGA 11 x 11 x 8
Product Category
For Processors
Description
27,95 x 24,76 x 8 mm, for IC design PGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 27.95mm |
| height | 8mm |
| plate thickness | 2.5mm |
| length | 24.76mm |
| thermal resistance | 16 – 7.8K/W |
| dissipation loss | 7.5W |
| surface | black anodised |
