Heatsinks for PGA – ICK PGA 16 x 16 x 10

Product ID

ICK PGA 16 x 16 x 10

Product Category

For Processors

Description

40 x 40 x 10 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 40mm
height 12.3mm
plate thickness 3.5mm
length 40mm
thermal resistance 10.5 – 3K/W
dissipation loss 12.9W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

ICK PGA 16 x 16 x 10

Product Category

For Processors

Description

40 x 40 x 10 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 40mm
height 12.3mm
plate thickness 3.5mm
length 40mm
thermal resistance 10.5 – 3K/W
dissipation loss 12.9W
surface black anodised

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

40mm

Width (mm)

40mm

Height (mm)

12.3mm

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