Heatsinks for PGA – ICK PGA 17 x 17 x 12

Product ID

ICK PGA 17 x 17 x 12

Product Category

For Processors

Description

43.6 x 43.6 x 12.3 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 43.6mm
height 12.3mm
plate thickness 3.5mm
length 43.6mm
thermal resistance 9 – 2K/W
dissipation loss 6.5W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

ICK PGA 17 x 17 x 12

Product Category

For Processors

Description

43.6 x 43.6 x 12.3 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 43.6mm
height 12.3mm
plate thickness 3.5mm
length 43.6mm
thermal resistance 9 – 2K/W
dissipation loss 6.5W
surface black anodised

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

43.6mm

Width (mm)

43.6mm

Height (mm)

12.3mm

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