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Heatsinks for PGA – ICK PGA 20 x 20 x 10

Description

Fischer Elektronik

Product ID

ICK PGA 20 x 20 x 10

Product Category

For Processors

Description

50 x 50 x 10 mm, for IC design PGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 50mm
height 10mm
plate thickness 2.5mm
length 50mm
thermal resistance 8.5 – 2.2K/W
dissipation loss 15.1W
surface black anodised

Datasheet

Download datasheet

Additional information

Surface

Length (mm)

50

Width (mm)

50

Height (mm)

10

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