Description
Product ID
ICK PGA 22 x 22
Product Category
For Processors
Description
54 x 54 x 20 mm, for IC design PGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 54mm |
| height | 20mm |
| plate thickness | 4mm |
| length | 54mm |
| thermal resistance | 6.2 – 1.8K/W |
| dissipation loss | 8.9W |
| surface | black anodised |
