Description
Product ID
ICK PGA 25 x 25
Product Category
For Processors
Description
62.5 x 62.5 x 20 mm, for IC design PGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 62.5mm |
| height | 20mm |
| plate thickness | 3.5mm |
| length | 62.5mm |
| thermal resistance | 5 – 1.1K/W |
| dissipation loss | 11.1W |
| surface | black anodised |
