Description
Product ID
ICK PGA 9 x 9
Product Category
For Processors
Description
24.2 x 24.2 x 12.3 mm, for IC design PGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 24.2mm |
| height | 12.3mm |
| plate thickness | 3.5mm |
| length | 24.2mm |
| thermal resistance | 14 – 3.3K/W |
| dissipation loss | 3W |
| surface | black anodised |
