Description
Product ID
ICK S R 28.5 x 12.5
Product Category
For Processors
Description
Ø 28,5 x 12.5 mm, pin heatsinks round
Parameters
Features
| design | round |
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| diameter | 28.5mm |
| height | 12.5mm |
| plate thickness | 3mm |
| weight | 5.7g |
| thermal resistance | 10.3 – 2.3K/W |
| dissipation loss | 5.83W |
| surface | Al-natural |
