Thermal conductive pasteand thermal interface film – FSF 20 P

Product ID

FSF 20 P

Product Category

Thermal Interface Material

Description

Phase Change thermal interface material

Parameters

  • density:: 2.9g/cm3
  • thermal resistance (1 in2, TO 3) at contact pressure of:: 0.08 K/W0.031 N/mm2
  • temperature range:: ≤+150°C
  • adhesive holding force:: 0.6N/mm2
  • dielectric constant:: 4.8 [1 kHz] / 4.4 [1 MHz]
  • class of inflammability:: UL 94 V-0

Features

material thickness 0.2±0,025mm
colour white
density 2.9g/cm3
phase change temperature 48°C
thermal conductivity 2W/m·K
thermal resistance (1 in2, to 3) at contact pressure of 0.08 K/W0.031 N/mm2
temperature range ≤+150°C
adhesive holding force 0.6N/mm2
dielectric constant 4.8 [1 kHz] / 4.4 [1 MHz]
class of inflammability UL 94 V-0
type of delivery plates, usable area 400x300mm

other dimensions upon request

storage conditions +1 °C – +30 °C

cool and dark

shelf life 6 months

Datasheet

Download datasheet

Description

Product ID

FSF 20 P

Product Category

Thermal Interface Material

Description

Phase Change thermal interface material

Parameters

  • density:: 2.9g/cm3
  • thermal resistance (1 in2, TO 3) at contact pressure of:: 0.08 K/W0.031 N/mm2
  • temperature range:: ≤+150°C
  • adhesive holding force:: 0.6N/mm2
  • dielectric constant:: 4.8 [1 kHz] / 4.4 [1 MHz]
  • class of inflammability:: UL 94 V-0

Features

material thickness 0.2±0,025mm
colour white
density 2.9g/cm3
phase change temperature 48°C
thermal conductivity 2W/m·K
thermal resistance (1 in2, to 3) at contact pressure of 0.08 K/W0.031 N/mm2
temperature range ≤+150°C
adhesive holding force 0.6N/mm2
dielectric constant 4.8 [1 kHz] / 4.4 [1 MHz]
class of inflammability UL 94 V-0
type of delivery plates, usable area 400x300mm

other dimensions upon request

storage conditions +1 °C – +30 °C

cool and dark

shelf life 6 months

Datasheet

Download datasheet

Add to Quote