Thermal conductive pasteand thermal interface film – FSF 30 P

Product ID

FSF 30 P

Product Category

Thermal Interface Material

Description

Phase Change thermal interface material

Parameters

  • density:: 2.4g/cm3
  • thermal resistance (1 in2, TO 3) at contact pressure of:: 0.1 K/W0.031 N/mm2
  • temperature range:: ≤+150°C
  • adhesive holding force:: 0.6N/mm2
  • dielectric constant:: 5.2 [1 kHz] / 4.8 [1 MHz]
  • class of inflammability:: UL 94 V-0

Features

material thickness 0.12±0,025mm
colour grey
density 2.4g/cm3
phase change temperature 50°C
thermal conductivity 3W/m·K
thermal resistance (1 in2, to 3) at contact pressure of 0.1 K/W0.031 N/mm2
temperature range ≤+150°C
adhesive holding force 0.6N/mm2
dielectric constant 5.2 [1 kHz] / 4.8 [1 MHz]
class of inflammability UL 94 V-0
type of delivery plates, usable area 400x300mm

other dimensions upon request

storage conditions +1 °C – +30 °C

cool and dark

shelf life 6 months

Datasheet

Download datasheet

Description

Product ID

FSF 30 P

Product Category

Thermal Interface Material

Description

Phase Change thermal interface material

Parameters

  • density:: 2.4g/cm3
  • thermal resistance (1 in2, TO 3) at contact pressure of:: 0.1 K/W0.031 N/mm2
  • temperature range:: ≤+150°C
  • adhesive holding force:: 0.6N/mm2
  • dielectric constant:: 5.2 [1 kHz] / 4.8 [1 MHz]
  • class of inflammability:: UL 94 V-0

Features

material thickness 0.12±0,025mm
colour grey
density 2.4g/cm3
phase change temperature 50°C
thermal conductivity 3W/m·K
thermal resistance (1 in2, to 3) at contact pressure of 0.1 K/W0.031 N/mm2
temperature range ≤+150°C
adhesive holding force 0.6N/mm2
dielectric constant 5.2 [1 kHz] / 4.8 [1 MHz]
class of inflammability UL 94 V-0
type of delivery plates, usable area 400x300mm

other dimensions upon request

storage conditions +1 °C – +30 °C

cool and dark

shelf life 6 months

Datasheet

Download datasheet

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