Thermal conductive pasteand thermal interface film – WLP 300 S

Product ID

WLP 300 S

Product Category

Thermal Interface Material

Description

silicon-containing thermally conductive paste

Parameters

  • density:: 1.1g/cm3
  • temperature range:: -40°C … +250°C

Features

material silicon thermal transfer compound
composition silicone oil, inorganic filling material
basin cartridge (310 ml)
specific electrical resistance >1012 Ω/cm
flashpoint none (DIN 53213)
drop point >260°C
delivery quantity 300g
thermal resistance no bleeding at (4 h/200°C)
acid number < 0.01mg KOH/g
consistance pastey
colour white
density 1.1g/cm3
thermal conductivity 0,61W/m·K
temperature range -40°C … +250°C
solubility in water insoluble

Datasheet

Download datasheet

Description

Product ID

WLP 300 S

Product Category

Thermal Interface Material

Description

silicon-containing thermally conductive paste

Parameters

  • density:: 1.1g/cm3
  • temperature range:: -40°C … +250°C

Features

material silicon thermal transfer compound
composition silicone oil, inorganic filling material
basin cartridge (310 ml)
specific electrical resistance >1012 Ω/cm
flashpoint none (DIN 53213)
drop point >260°C
delivery quantity 300g
thermal resistance no bleeding at (4 h/200°C)
acid number < 0.01mg KOH/g
consistance pastey
colour white
density 1.1g/cm3
thermal conductivity 0,61W/m·K
temperature range -40°C … +250°C
solubility in water insoluble

Datasheet

Download datasheet

Add to Quote