Heatsinks for BGAs – ICK BGA 25 x 25 x 14

Product ID

ICK BGA 25 x 25 x 14

Product Category

For Processors

Description

25 x 25 x 14 mm, for IC design BGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 25mm
height 14mm
plate thickness 1.8mm
length 25mm
thermal resistance 17 – 7.5K/W
dissipation loss 3.5W
surface black anodised

Datasheet

Download datasheet

Description

Product ID

ICK BGA 25 x 25 x 14

Product Category

For Processors

Description

25 x 25 x 14 mm, for IC design BGA and others

Parameters

Features

way of fixation therm. conductive foil

therm. cond. adhesive

socket universal
suitable for processor type universal
width 25mm
height 14mm
plate thickness 1.8mm
length 25mm
thermal resistance 17 – 7.5K/W
dissipation loss 3.5W
surface black anodised

Datasheet

Download datasheet

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